发明名称 |
ENCAPSULATED PACKAGING IN BETWEEN 2 PCBS |
摘要 |
An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.
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申请公布号 |
WO0106821(A1) |
申请公布日期 |
2001.01.25 |
申请号 |
WO2000US18081 |
申请日期 |
2000.06.28 |
申请人 |
INCEP TECHNOLOGIES, INC. |
发明人 |
DIBENE II, JOSEPH, TED;HARTKE, DAVID |
分类号 |
G06F1/18;H05K1/02;H05K1/14;H05K3/36;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
G06F1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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