ADHESIVE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive capable of bonding a semiconductor chip to a chip-attaching member interposing a sufficient and definite gap to sufficiently relax the mechanical stress applied to the chip and provide a semiconductor device having excellent reliability. SOLUTION: The objective adhesive 3 for bonding a semiconductor chip 1 to a chip-attaching member 2 is composed of a curable polymer composition containing a spherical filler having an average particle diameter of 100-1,000 μm (excluding 100 μm) and an aspect ratio of 1.0-1.5. The semiconductor device is produced by bonding a semiconductor chip 1 to a chip-attaching member 2 with the above adhesive 3.