| 摘要 |
PROBLEM TO BE SOLVED: To achieve conductivity which is high even with low resistivity provided from high temperature sintering type paste with even slender circuit line width, by specifying the maximum diameter of a spherical silver powder, the maximum length of a flake-like silver powder, molecular weight of an ammonia resol based resin as a low-temperature hardening resin, and a boiling point of a high-boiling point organic solvent, and mixing respective specific amount of them and a plasticizer. SOLUTION: The diameter of a spherical silver powder and the maximum length of a flake-like silver powder are less than a half of the minimum drawn line width, a low temperature hardening resin is an ammonia resol based resin and a high molecular type resin with 10,000 or higher molecular weight, a solvent is a high boiling point solvent having 150 deg.C or higher normal pressure boiling point that is inert to an ammonia resol based resin, and a plasticizer is an alkoxy group containing denaturation silicone oligomer based plasticizer which is solvable in the solvent. The low- temperature hardening resin of 4-17 pts.wt. and 2-10 pts.wt. plasticizer are mixed with respect to 100 pts.wt. metal silver powder, and 10-40 pts.wt. solvent is mixed with total 100 pts.wt. of metal silver powder, low-temperature hardening resin, and plasticizer. This can be used for drawing a line narrower than 50μm.
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