| 摘要 |
PROBLEM TO BE SOLVED: To provide an airtight terminal equipped with a brazing filler metal free of Pb which has a comparatively high fusing point and is not fused by heating at the time of reflow of a brazing filler metal free of substitute Pb of Sn-Pb eutectic solder. SOLUTION: An Au layer 4 turned to a brazing filler metal alloyed with a Sn layer by heating is formed at the tip part of a lead 3, and the Sn layer 5 is formed on the exposed parts of a metallic outer ring 1 and the lead 3. The Au layer 4 is formed by electroless Au plating, and its thickness is set in accordance with the composition of a brazing filler metal of a Sn-Au alloy on target. For example, if a brazing filler metal of a Sn-30% Au alloy is targeted, the Au layer 4 is formed so as to have a thickness of about 1.5-2.5μm, and the Sn layer 5 is formed so as to have a thickness of about 7.5-8.5μm.
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