| 摘要 |
PROBLEM TO BE SOLVED: To obtain a mounting method in which a semiconductor device component can be protected from a corrosion component contained in a medium to be measured and in which the corrosion resistance and the reliability of the semiconductor device component can be enhanced by a method wherein the surface is covered with a corrosion-resistant metal film. SOLUTION: The surface of a semiconductor device component as a whole is covered with a highly corrosion-resistant metal thin film 52, and it is protected from a corrosion component in a medium to be measured. The metal thin film 52 is formed in such a way that, after a glass member 20 is bonded to a fixation based 30, the whole is covered by a sputtering operation or a vapor evaporation operation, and it is formed of, e.g. a thin film such as an Au-Si thin film or the like. A silicon member 10 is provided with a diaphragm and a gage resistance, and lead wires 40 are used to take out an electric signal to the outside via through-hole parts from the silicon member 10. A substrate metal film 51 is formed so as to ensure the adhesiveness of the glass member 20 with a bonding metal material 54, and it is composed of, e.g. Al/Ni, Cr/Pt or the like. In addition, a highly corrosion-resistant material can be replaced by, e.g. an inorganic substance such as silicone, alumina or the like or an organic substance such as silicone rubber or the like.
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