HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING

摘要

A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

主权项

1. A method of facilitating extraction of heat from a heat-generating electronic component, the method comprising:
providing a heat sink assembly comprising:
a thermally conductive heat sink with at least one coolant-carrying channel;a membrane structure associated with and overlying the at least one coolant-carrying channel, the membrane structure comprising at least one vapor-permeable region, at least a portion of the at least one vapor-permeable region overlying a portion of the at least one coolant-carrying channel and facilitating removal of vapor from the at least one coolant-carrying channel, and the membrane structure further comprising at least one orifice coupled to inject coolant onto a surface of the thermally conductive heat sink within the at least one coolant-carrying channel intermediate ends of the at least one coolant-carrying channel without the coolant contacting the heat-generating electronic component; andat least one plate mask associated with the membrane structure and defining a multilayer structure, the at least one plate mask comprising at least one opening aligned to at least a portion of the at least one vapor-permeable region of the membrane structure and defining at least one vapor-permeable region of the multilayer structure; and coupling the heat sink assembly to the at least one heat-generating electronic component so that heat generated by the at least one heat-generating electronic component is dissipated through the thermally conductive heat sink to coolant within the at least one coolant-carrying channel of the heat sink without the coolant contacting the heat-generating electronic component, wherein vapor generated within the at least one coolant-carrying channel can exhaust from the at least one coolant-carrying channel across the at least one vapor-permeable region of the membrane structure.