| 摘要 |
PROBLEM TO BE SOLVED: To provide a terminal of low manufacturing cost and mounting cost having high degree of freedom in arrangement and dimensions, and to provide a surface mounting module using that terminal, and manufacturing methods therefor.SOLUTION: A surface mounting module 10 includes an electronic component mounting circuit board 13 mounting an electronic component 11 and provided, on the lower surface thereof, with a plurality of terminal connection pads 12 on one straight line, and terminals 16 each having a rectangular parallelepiped insulation member 14 having a side face 14a and a side face 14b which is the opposite surface of the side face 14a, and a plurality of interconnections 15 formed on the side face 14a and running in the direction connecting the upper and lower sides of the side face 14a of the insulation member 14. The terminals 16 are mounted on the lower surface of the electronic component mounting circuit board 13 so that the side face 14a of the insulation member 14 intersects the main surface of the electronic component mounting circuit board 13 perpendicularly, and the plurality of interconnections 15, 15, ... correspond to a plurality of pads 12, respectively, and the interconnections 15 are soldered to the pads 12. |
