| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable semiconductor device and a method for manufacturing the device, which can suppress its deterioration with time while using copper wiring. SOLUTION: A connection part 44 to a connection electrode (pad) 3 made of a copper film on a semiconductor substrate 10 or between the electrode 3 and a bonding wire 43 is arranged so that copper is not exposed onto the surface of the connection part 44. Consequently, there can be obtained a reliable semiconductor device which suppresses its deterioration with time with use of a copper wiring. When an Al wiring is formed on a semiconductor element using a copper wiring 6, an Al pad 40 is formed not immediately above the copper pad 3 but at a position of a passivation insulating film 4 shifted with respect to the copper pad. A stress during bonding is not exerted up to the Cu wiring and copper is not exposed onto the surface thereof. As a result, there can be formed a reliable semiconductor device which prevents deterioration of the copper wiring with time such as oxidation or corrosion. |
