| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure wherein mounting density during mounting is further improved by eliminating deformation and cracks of a package even if thermal hysteresis is applied in mounting. SOLUTION: In the device 50, a step due to a land 17 provided to a lower surface of a base material 12 is eliminated by forming a solder resist 22 between a base material 12 and a sheet-like elastomer 26. A semiconductor element 28 and a semiconductor element 54 are laminated and arranged inside the same package and electrically connected to the land 17 by inner leads 18, 58, 60. As a result, it is constituted to have a package and the land 17 in common. |
