发明名称 SOLID-STATE IMAGING PICKUP DEVICE
摘要 PROBLEM TO BE SOLVED: To lessen false signals, improve S/N ratios of video signals, enable SOC, and reduce process-like loads, and reduce the manufacturing cost. SOLUTION: A solid-state image pickup device, having a photoelectric conversion part 101 with photoelectric conversion regions 14 and a logic circuit part 106 formed on a semiconductor substrate 11, so as to output a potential change due to charges generated in the conversion regions 14 comprises a shade layer 20 covering the logic circuit part 106 and a shade film 24 defining light incident regions with respect to the conversion regions 14 and the shade film 24 locates at a mid position between the shade layer 20 and the conversion region 14 in a light incidence direction.
申请公布号 JP2001015725(A) 申请公布日期 2001.01.19
申请号 JP19990186709 申请日期 1999.06.30
申请人 NEC CORP 发明人 NAKASHIBA YASUTAKA
分类号 H01L23/60;H01L27/14;H01L27/146;H01L27/148;H04N5/335;H04N5/357;H04N5/369;H04N5/372;H04N5/3745;(IPC1-7):H01L27/14 主分类号 H01L23/60
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