| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing such a printed wiring board that is easy to be ground and high in yield and a mask therefor, by flatening the surface of a resin protruding over the surface of a substrate to be filled when a through hole of a through via conductor formed in the substrate is filled with a resin paste and it is heated and cured. SOLUTION: In this method for producing a printed wiring board, a substrate 1 to be filled provided with a plurality of through via conductors 5 having through holes 4 (4A, 4B, 4C, and 4D) is filled and buried with a resin paste in the through holes 4 from the side of the surface 1A of the substrate 1, and the resin paste 7 is heated and cured, and then the unnecessary resin is removed by grinding. When filling the holes 4 with the resin paste 7 by printing, the hole 4 having the smallest interval among the adjoining through holes 4 is filled with a smaller quantity of resin paste 7 than that having a larger interval, by printing using a metal mask 31.
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