Pyroelectric infrared array sensor

摘要

A pyroelectric infrared array sensor has a pyroelectric element on which a plurality of sensing sections are formed, each of which has upper and lower electrodes which confront each other through the pyroelectric element. To fixedly secure the pyroelectric element to a substrate, lead conductors extended from sensing sections located adjacent to the edges of the light receiving surface of the pyroelectric element are fixedly connected to the substrate by conductive paste. The lower electrodes are connected to solder bumps on the substrate with conductive paste. The respective dimensions of the solder bumps can be adjusted so as to adjust the amount of heat conducted away from the sensing sections and thereby make the heat-sensitivity of the sensing sections more uniform. Alternatively or in addition, the amount of conductive paste used to connect the lower electrodes to the solder bumps can be adjusted for the same purpose.