| 摘要 |
An improved wafer scale integrated circuit is described which includes non-contact power and data transmission coupling. Wireless power and data coupling reduces the mechanical stresses and strains on the wafer, and makes better use of the wafer area. An additional benefit comes from allowing better heat transfer management. In one embodiment, power is provided by inductive coupling. Data flow into and out of the wafer is accomplished optically, using optical detectors to receive and light emitting diodes to transmit. Multiple devices are integrated onto the semiconductor wafer. Systems may be incorporated using the traditional die sites. Connections between systems are made in the space between die sites.
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