发明名称 PHENOLIC RESIN FOAM
摘要 PROBLEM TO BE SOLVED: To obtain a resin foam having a fine cell structure and excellent thermal conductivity, compressive strength, mechanical strengths, and heat insulation properties by using an oligomer of trifluorochloroethylene in a specified ratio. SOLUTION: A modifier such as urea, an amine, an amide, an epoxy compound, a monosaccharide, a starch, a poval resin, a polyvinyl alcohol resin, or a lactone is added to a resol resin to obtain a resol resin composition having a viscosity of 1,000-50,000 cP. The composition is mixed with 0.1-10 wt.% oligomer of trifluorochloroethylene, a blowing agent selected from low-boiling hydrocarbons and hydrofluorocarbons, a surfactant, and a curing catalyst, and the mixture is foamed. The oligomer is one represented by the formula (wherein (n)is 4-13), having an average molecular weight of about 500 to 1,500, and being oily to waxy at ordinary temperature dependent on the average molecular weight.
申请公布号 JP2001011230(A) 申请公布日期 2001.01.16
申请号 JP19990179467 申请日期 1999.06.25
申请人 ASAHI CHEM IND CO LTD 发明人 WATANABE TAKAYASU
分类号 C08J9/14;C08K5/02;C08L61/06;(IPC1-7):C08J9/14 主分类号 C08J9/14
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