发明名称 FORMATION OF TUNGSTEN FILM, SEMICONDUCTOR DEVICE AND FILM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a CVD film forming method for forming a W new creation film of high quality on a WxN film and moreover forming a W film of high quality thereon. SOLUTION: Gaseous SiH4 is sprayed for a prescribed time on the surface of a WxN film of the substrate to be treated from the feeding source thereof, and, after that, the W new creation film is formed by the CVD method. Then, with the W new creation film as the nucleus, by the CVD method, the W film is formed. By feeding only the gaseous SiH4 before the formation of the W new creation film, the W new creation film of high quality can be formed on the WxN film.
申请公布号 JP2001011628(A) 申请公布日期 2001.01.16
申请号 JP19990174254 申请日期 1999.06.21
申请人 APPLIED MATERIALS INC 发明人 KITAZAKI MASAKI;NISHINA KAZUHIRO
分类号 C23C16/02;C23C16/14;C23C16/34;H01L21/28;H01L21/285;(IPC1-7):C23C16/02 主分类号 C23C16/02
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