发明名称 EPOXY RESIN COMPOSITION, PREPREG AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition useful for e.g. prepregs with low hygroscopicity and excellent dielectric properties by including a specific novolak- type epoxy resin, a curing agent and a specific polyamide-butadiene-acrylonitrile copolymer. SOLUTION: This epoxy resin composition is obtained by including (A) a novolak-type epoxy resin having both phenol skeleton and naphthol skeleton, (B) a curing agent (e.g. phthalic anhydride) and (C) a phenolic hydroxyl group- contg. polyamide-butadiene-acrylonitrile copolymer, wherein the amount of the component B to be used is pref. 0.3-2.0 in terms of the equivalent ratio to the epoxy group in the component A and that of the component C is pref. 10-90 wt.% based on the whole composition. By the way, the component C is obtained, for example, by the following process: a diamine is added to a phenolic hydroxyl group-contg. dicarboxylic acid followed by conducting a condensation reaction in the presence of a phosphorous ester and a pyridine derivative and then carrying out a polycondensation between the reaction product and a polybutadiene-acrylonitrile copolymer respectively having carboxyl groups on both the terminals.
申请公布号 JP2001011160(A) 申请公布日期 2001.01.16
申请号 JP19990184965 申请日期 1999.06.30
申请人 NIPPON KAYAKU CO LTD 发明人 ASANO TOYOFUMI;NIIMOTO HARUKI
分类号 H05K1/03;C08G59/62;C08J5/24;(IPC1-7):C08G59/62 主分类号 H05K1/03
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