METHOD FOR PREVENTING CRACK OF SOLDER BALL OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for preventing the crack of a solder ball of a semiconductor package is provided to prevent the solder ball form cracking by arranging dummy bumps around the solder ball. CONSTITUTION: A solder ball(90) is mounted on a ball land formed at a side of a package body for sealing a semiconductor chip. The solder ball(90) is installed on a semiconductor substrate. A dummy bump land is formed along a periphery portion of the ball land(41). Dummy bumps(80,81) are arranged on the dummy bump land(42). The dummy bumps(80,81) receive the shear stress prior to the solder ball. The dummy bumps(80,81) are arranged in circle pattern at edges of the semiconductor body and both sides of the solder ball(90).