| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for managing a sputtering stage stabilizing the quality of a product by maintaining the adhesion of a plating substrate to an insulating base material to a high level. SOLUTION: In pretreatment at the time of forming a plating substrate by DC sputtering on an insulating base material 4 composed of a polyamide resin, the insulating base material 4 is fitted to an electrode 2, and moreover, plasma bombardment is applied on the surface of the insulating base material 4 by using gaseous nitrogen as reverse sputtering gas. At the time of the plasma bombardment, at least one among vacuum pressure before the introduction of the gaseous nitrogen into a chamber 1 deposited with the insulating base material 4, high frequency incident waves on the electrodes 2 and 3 in the process of the plasma bombardment, high frequency reflecting waves from the electrodes 2 and 3 and the pressure of the gaseous nitrogen is controlled as a managing item. For increasing the forming rate of polar functional groups on the surface of the insulating base material 4 at the time of the plasma bombardment by controlling these managing items, the d.c. bias voltage in the process of the plasma bombardment is managed or controlled.
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