LOADING DEVICE OF TRIM/FORMING APPARATUS FOR FABRICATING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An loading device of a trim/forming apparatus for fabricating a semiconductor package is provided to improve productivity by loading a semiconductor package to a transfer rail of a trim/forming apparatus. CONSTITUTION: A rotary cylinder(2) is used for providing a rotary force. A rotary portion is connected with the rotary cylinder by a belt. The rotary portion is rotated according a period of 180 degrees. A transfer portion(10) is installed at a lower end portion of the rotary portion. The transfer portion(10) is formed with a cylinder(14), an absorption portion(16), and a spring(12). The cylinder(14) is operated by an air pressure or an oil pressure. The absorption portion(16) is connected with the cylinder(14). The spring is installed between upper ends of the absorption portion(16) and the cylinder(14). A multitude of vacuum pad(16a) is installed in the absorption portion(16). The transfer portion(10) is rotated by the rotary portion. A magazine loading portion(30) is installed at a lower end of the transfer portion(10) in order to load a magazine(50) including a semiconductor package(20).