| 摘要 |
<p>A partly wet-chemical or electrochemical processing - according to a freely selectable pattern - of the surface 19 of a silicon chip 1 for solar cell production is achieved using a mask, Fig. 4, which is pressed onto the silicon chip through the evacuation of a cavity system 14, 15 located in its interior and the formation of suitable connections to the side 5 facing said silicon chip, a rubber 2 arranged at the surface providing for acid- and alkali-proof covering of the areas 16 that are not to be processed. <IMAGE></p> |
