| 摘要 |
PURPOSE: A baking tool for a semiconductor wafer is provided to improve the quality of the semiconductor device by normally maintaining the quality of the photoresist coated on the semiconductor wafer. CONSTITUTION: A baking tool for a semiconductor wafer(2) comprises a body(11). A shutter(12) is provided to close or open an inlet of the body(11). Upper and lower heating plates(13,14) are installed in the body(11) in opposite to each other. When the wafer(2) is loaded into the body(11), the upper and lower heating plates(13,14) make contact with the wafer(2) for baking the wafer(2). A plurality of supporting pins(15) are installed on the lower heating plate(14) so as to control the up and down movement of the lower heating plate(14). The supporting pins(15) are integrally formed with the lower heating plate(14).
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