| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a lead frame for a semiconductor package wherein such deformation as warping of a flexible circuit board is reduced when the flexible circuit board is bonded to a metal frame. SOLUTION: When a metal frame 12 is bonded to a flexible circuit board 14 by thermo-setting an adhesive 16, the metal frame 12 is cooled. Thus, the heat for setting the adhesive 16 is transferred to the adhesive 16 through an adhesive coating part of the metal frame 12, not allowing it to be transferred to other part. As a result, the thermal expansion of the metal frame 12 is almost eliminated (allowing the thermal expansion of the metal frame 12 to be almost equal to that of the flexible circuit board 14), suppressing occurrence of warping of the flexible circuit board 14 after its bonding. |
