| 摘要 |
PROBLEM TO BE SOLVED: To form guide electrodes to a larger film thickness and to make a contribution to lowering of resistance by forming the guide electrodes to be electrically connected to at least either of first electrodes and second electrodes by a plating method. SOLUTION: The surface of a substrate 1 is provided with the first electrodes 2 consisting of ITO and insulating layers 3 intersecting therewith are formed thereon. Further the guide electrodes 8 are formed on the insulating layers 3. At this time, the guide electrodes 8 which stop the progression of the plating in the state lower in the thickness than the resist film thickness are used. Namely, if second electrode materials are deposited by diagonal vapor deposition as partition walls after the formation of thin-film layers 15, the one side of the guide electrodes 8 attains the state that the guide electrodes are electrically connected to the second electrodes 14. The other side has the form separated from the second electrodes 14 and, therefore, shorting does not occur and the guide electrodes 8 play the role as a function element in the process for production of the display device and are simultaneously capable of exhibiting the intrinsic function as the guide electrodes 8. As a result, the flawing of the thin- film layers 15 may be prevented.
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