METHOD FOR ASSEMBLING SUBSTRATES AND DEVICE THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a method for assembling substrates capable of bonding the substrates to each other in a vacuum with high accuracy and good productivity and a device therefor. SOLUTION: The one substrate to be bonded is held on the rear surface of a pressurizing plate 27 and another substrate to be bonded is held on a table 9 so as to face the one substrate. The spacing between the substrates is narrowed and the substrates are bonded in the vacuum by an adhesive disposed at either of the substrates. While pressing force is acted in part of the respective peripheral edges of the substrates between the substrates and the pressurizing plate 27 or the table, pressure reduction is progressed.