| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce adhesion defects of solder resist in a BGA by preventing solder resist from being formed in the periphery of a pad part which does not receive solder balls. SOLUTION: In a TAB tape 1, a solder ball via part 4 which is a hole for forming a solder ball is formed in a base 2. There is formed a copper pattern 5, which becomes a wiring pattern, is formed on the base 2, and a wire bond pad part 6 for wire bonding, a ball pad 7 for receiving a solder ball and a land part 8 of a solder ball are formed in a circumferential and a central copper pattern 9 which becomes a dummy pattern for preventing warpage of a spacer and the base 2 during mounting of a chip at a center. Furthermore, one pad part which does not receive solder balls is formed as a mark part 16 for orientating of the TAB tape 1, so that a solder resist 15b will not form near the mark part 16.</p> |
