发明名称 LASER MATERIAL PROCESSING DEVICE AND ITS METHOD
摘要 <p>PROBLEM TO BE SOLVED: To exactly process an object to be processed with a laser by easily and precisely measuring the generating position or strength of ultrasonic waves generated in irradiating the object to be laser-processed with laser beams. SOLUTION: This device is provided with a laser device 1 for generating modulating laser beams, an irradiating means 7 arranged so as to be displaceable to the object 10 to be processed for irradiating the object to be processed with the modulating laser beams, an ultrasonic receiving means 8 arranged on the same axis as the irradiating means for receiving ultrasonic waves generated from a laser beam irradiating point on the object to be processed, and a signal processor 14 for calculating the propagating distance of the ultrasonic waves from a signal from the ultrasonic receiving means and a signal from the laser device, and for calculating the shape of the object to be processed from the propagating distance and the position and attitude information of the irradiating means.</p>
申请公布号 JP2001004354(A) 申请公布日期 2001.01.12
申请号 JP19990176241 申请日期 1999.06.23
申请人 TOSHIBA CORP 发明人 CHIHOSHI ATSUSHI;OCHIAI MAKOTO;KANEMOTO SHIGERU;SANO YUJI;SATO KATSUHIKO;OGISU TATSUKI;YAMAMOTO TETSUO;TOKORO TETSUYA
分类号 B23K26/02;B23K26/00;B23K26/03;G01B11/00;G01B17/00;G01B17/06;G01B17/08;G01S15/88;G21C19/02;(IPC1-7):G01B17/00 主分类号 B23K26/02
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