发明名称 ELECTRONIC APPARATUS FRONT PANEL
摘要 PROBLEM TO BE SOLVED: To enable a molded resin member to be easily installed on a panel and an electronic apparatus front panel to be improved in yield in an apparatus assembly process by a method wherein pawls are provided in one of molded resin members so as to fix the other molded resin member, and engaging parts which are engaged with the above pawls are provided in the other molded resin member. SOLUTION: Protrusions 102 are provided in the top and under surface of a U-shaped front panel 2 in a symmetrical manner, and molded resin members 3 are made to bear against the protrusions 102 respectively. L-shaped openings 103 are provided in the top and under surface of the resin member 3 respectively. The openings 103b are each aligned with the protrusions 102b provided in the inner side of the panel 2, and the molded resin member 3b is mounted on the panel 2 making the protrusions 102b serve as a guide. When the resin members 3 are mounted on the panel 3, pawls 101a provided in the resin member 3a are engaged with locking parts 104b provided in one edge of the resin member 3b, and the pawls 101c of the resin member 3c are engaged with locking parts 104b provided in the other edge of the resin member 3b. Thereafter, the resin members 3 are surely fastened to the panel 2 with screws 32 put in through-holes 31.
申请公布号 JP2001007540(A) 申请公布日期 2001.01.12
申请号 JP19990170785 申请日期 1999.06.17
申请人 NEC CORP 发明人 KATO TETSURO
分类号 H05K5/02;H05K5/00;(IPC1-7):H05K5/02 主分类号 H05K5/02
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