| 摘要 |
PROBLEM TO BE SOLVED: To raise a soldering strength. SOLUTION: An SVP(surface vertical package) IC16 comprises a semiconductor pellet 11, a plurality of inner leads 7 electrically connected to electrode pads 11a of the pellet 11 by means of wires 13, outer leads 9 connected to the inner leads 7, and a resin sealing body 14 where the pellet 11, wire 13, and inner lead 7 are resin-sealed. A soldering mounting pad 9a of the plurality of outer leads 9 protruding above the lower surface of the resin sealing body 14 is formed into a ball. The soldering part is placed thick in the place under the ball-like soldering mounting part while formed by a constant thickness over the entire circumference, so the mechanical strength at the soldering part is high and constant, preventing occurrence of a crack due to insufficient solder. |
