| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve positioning accuracy by calculating an amount of relative position deviation between a head and a work from the recognition result of first and second optical recognition means and instructing the drive mechanism of each axis of the head and work to move based on the operation results. SOLUTION: Two CCD cameras 31 that become a second optical system recognition means are arranged so that they overlap each other back and forth at the upper portion of a wafer-positioning position 8. The CCD cameras 31 can be moved in a direction in parallel with a work drive mechanism 4 by a motor 33. Then, the amount of relative position deviation is calculated from the recognition result of an alignment mark 17 of the head according to CCD cameras 23 and 23' that become the first optical system recognition means and the posture of the work according to each CCD camera 31 by an arithmetic unit. Based on the operation result, an instruction is given to the drive mechanism of each axis of the head and work to move or rotate, thus improving the positioning accuracy.</p> |
