| 摘要 |
PROBLEM TO BE SOLVED: To provide a formation method for a conductor pattern wherein a circuit pattern is surely formed even with a substrate comprising such a material as of low moisture-resistance and chemical-resistance while a lower resistance is realized by a low-cost and simple method. SOLUTION: Related to method for forming, as a pattern, a conductor layer 21 on a substrate 1, a desired resin pattern 20 is formed of a thermo-plastic resin on the substrate 1, on which the conductor layer 21 is laminated with the thermo-plastic resin constituting the resin pattern 20 as an adhesive component. As another method, adhesive conductor particles wherein at least a part of conductor particle is coated with the thermo-plastic resin to form an adhesive part are allowed to deposit on the surface of substrate, and then the adhesive parts of the adhesive conductor particles are softened or melted under heat to provide a resin pattern, forming a conductor layer of conductor particles.
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