Flexible circuit board manufacturing method

摘要

The method involves applying a metallic conductor track film (2) to a base film (1). The track film is structured to produce tracks, and a cover film (6) is applied over the tracks. The cover film includes a first contact opening (8). The base film material (1) is locally removed using laser processing, to produce a second contact opening (9) in the base film. The laser processing may be performed later then the step of applying a cover film.