| 摘要 |
PURPOSE: A system for detecting a repeat fail chip and a method thereof are provided, which perform a process of finding a repeat fail chip automatically. CONSTITUTION: The system comprises a tester(10), a prober(12), a control part(14) and a monitor(16). The tester stores test programs, and outputs a test result(bin) after performing the test program and completing the test if a test start(TS) command is inputted. The bin is 1, 2 and 3 which indicate the kind of chip fail. The prober loads and arranges a wafer to be tested and enables the tester to perform the test through a probe card. If the test is ready, the probe outputs the test start command to the tester, and outputs present coordinate values(X,Y) of a chip in the wafer to the control part. And the probe receives the test result from the tester and outputs it to the control part. The control part stores the coordinate values and bin value(X,Y,bin) as to each wafer from the prober, and makes a wafer map by inputting the coordinate values and the bin value as to the corresponding wafer. And a composite map is made using the above maps, and thus a repeat fail chip is extracted. The monitor displays the result if necessary.
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