发明名称 |
Adhesive composition for bonding semiconductor chips |
摘要 |
Disclosed is an adhesive resin composition for bonding semiconductor chips comprising an adhesive resin component, a curing agent, a diluent, a curing promoter, a thixotropic agent, and an inorganic filler component. The resin component is approximately 10-50% by weight, and the inorganic filler component is approximately 50-90% by weight and comprises a copper ingredient and a silver ingredient. The copper ingredient is selected from the group consisting of CuO, Cu2O, with the mixtures thereof being approximately 0.1-50% by weight based on the total weight of said inorganic filler component. The silver ingredient is approximately 50-99.0% by weight based on the total weight of the inorganic filler ingredient. |
申请公布号 |
EP0971009(A3) |
申请公布日期 |
2001.01.10 |
申请号 |
EP19990113152 |
申请日期 |
1999.07.07 |
申请人 |
ANAM SEMICONDUCTOR, INC.;AMKOR TECHNOLOGY INC.;NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
KWAK, JAE-SUNG;MOON, BYUNG-HOON |
分类号 |
H01L21/52;C08L63/00;C09J163/00;C09J201/00;H01L23/28;H01L23/495 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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