Thin plate member for semiconductor package and manufacturing method therefor,申请号US09/076264-传众专利搜索

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发明名称	Thin plate member for semiconductor package and manufacturing method therefor
摘要
申请公布号	US6172415(B2)	申请公布日期	2001.01.09
申请号	US09/076264	申请日期	1998.05.12
申请人		发明人
分类号		主分类号
代理机构		代理人
主权项
地址

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