发明名称 Method of manufacturing photo diode
摘要 A structure of a photo diode and a method of manufacturing a photo diode comprise the steps of providing a substrate having an isolation region and a device region. A doped region is formed adjacent to the isolation region in the substrate by performing an ion implantation step and an annealing step. Next, a protective layer utilized to prevent the plasma damage is formed on the substrate and the isolation region, and an inter-layer dielectric layer is formed on the protective layer. Thereafter, a contact hole is formed to expose a portion of the doped region by patterning the inter-layer dielectric layer and the protective layer, and a contact plug is formed by filling the contact hole with a conductive material.
申请公布号 US6171882(B1) 申请公布日期 2001.01.09
申请号 US19980210526 申请日期 1998.12.11
申请人 UNITED MICROELECTRONICS CORP. 发明人 CHIEN CHENG-HUNG;HSU JEN-YAO;PAN JUI-HSIANG
分类号 H01L21/00;(IPC1-7):H01L21/00 主分类号 H01L21/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利