| 摘要 |
PROBLEM TO BE SOLVED: To surely remove solder adhering to the inside of a substrate holding groove of a substrate carrier with a simple constitution. SOLUTION: In this solder removing tool 10, a fluororesin claw member 11 is fixed to the specified position by a fixing mechanism 13 so as to be fitted in a holding groove 1a of a carrier 1 which is carried in a return section 5b of a carrying passage, and solder 9 adhered to the inside of the holding groove 1a of the carrier 1 is scraped off by the claw member 11. Since the claw member 11 is held in a retracting manner in the retracting direction A away from the carrier 1 by a holding member 25 while urged by an urging mechanism 27, the load on the claw member 11 and the carrier 1 through the interference with the solder 9 is reduced in removing the solder. |
