| 摘要 |
PROBLEM TO BE SOLVED: To obtain a liquid light-sensitive resin for producing a printing plate and a duplication model, or for protecting and covering an electronic circuit, capable of allowing a thick layer of >=0.5 mm to be hardened by the exposure in air, having no tackiness on a surface, and hardly causing shrinkage at the time of hardening. SOLUTION: This liquid light-sensitive resin composition consists essentially of a compound having two or more epoxy groups in the molecule, an ethylenically unsaturated compound simultaneously having hydroxy group and an ethylenically unsaturated bond (e.g. methacryloyl group) in the molecule, and a compound generating an acid by absorbing ultraviolet rays. |
