发明名称 |
PHOTOELECTRIC WIRING BOARD, PACKAGING BOARD, AND PHOTOELECTRIC WIRING BOARD PRODUCING METHOD |
摘要 |
A photoelectric wiring board (10) which comprises a board (11) formed with a through-hole, and a photo-wiring layer (12) consisting of a core (120) laminated to the board (11) for transmission of light and a clad (121) holding the core (120), wherein the electric wiring board (11) has an electric wiring formed on one surface, and pads (15, 17) electrically connected to the electric wiring and disposed around the through-hole in one surface to install photo-parts, the core (120) having a horizontal waveguide (120a) for horizontal propagation of light along the electric wiring board (11), and a vertical waveguide that is a waveguide crossing the horizontal waveguide (120a) and part of which is disposed in the through-hole to propagate light in a direction normal to the electric wiring board (11). |
申请公布号 |
WO0101176(A1) |
申请公布日期 |
2001.01.04 |
申请号 |
WO2000JP04174 |
申请日期 |
2000.06.26 |
申请人 |
TOPPAN PRINTING CO., LTD.;TSUKAMOTO, TAKEHITO;YOSHIDA, MASAKICHI;MINATO, TAKAO |
发明人 |
TSUKAMOTO, TAKEHITO;YOSHIDA, MASAKICHI;MINATO, TAKAO |
分类号 |
G02B6/138;G02B6/42;G02B6/43;H05K1/02 |
主分类号 |
G02B6/138 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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