发明名称 PHASE-SHIFT PHOTOMASK FOR PATTERNING HIGH DENSITY FEATURES
摘要 <p>A method for forming a photomask includes providing a transparent substrate and forming an opaque layer over at least a first portion of the transparent substrate. The opaque layer is patterned to define a mask pattern and expose at least a second portion of the transparent substrate. The second portion is etched to define a phase shifting region. The width of the phase shifting region defines a critical dimension. The critical dimension is measured, and the phase shifting region is etched based on the critical dimension to undercut the optically opaque layer. A photomask includes a transparent substrate and a phase shitting region defined in the transparent substrate. The phase shifting region includes sloped sidewalls having a slope of less than about 85 DEG .</p>
申请公布号 WO0101198(A1) 申请公布日期 2001.01.04
申请号 WO2000US00697 申请日期 2000.01.11
申请人 ADVANCED MICRO DEVICES, INC. 发明人 NISTLER, JOHN, L.;BROWN, STUART, E.
分类号 G03F1/28;G03F1/30;(IPC1-7):G03F1/00 主分类号 G03F1/28
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