摘要 |
<p>A latex for dip forming which is a latex of a copolymer obtained by polymerizing monomers comprising 10 to 90 wt.% conjugated diene, 0.1 to 20 wt.% ethylenic acid, and 10 to 89.9 wt.% other ethylenic monomer(s) copolymerizable with these monomers, wherein the sum of the amount of the acid groups bonded to or adsorbed on the surface of the copolymer as a component of the latex and that of the acid groups present in the aqueous phase of the copolymer latex is 0.1 to 2 meq, in terms of hydrochloric acid, per g of the copolymer. This latex is molded by dip forming to obtain a molding which has no fear of causing protein allergy, feels soft to the touch, and has excellent mechanical strength.</p> |