| 摘要 |
The embossing device comprises in combination: a first embossing unit (1) wi th a first embossing cylinder (3) provided with a first set of points (3P) and interacting with a first pressure cylinder (5) for forming, on a first ply (V1), a first set of protuberances (V1p) having small sizes and a high density; a second embossing unit (7) with a second embossing cylinder (9) provided with a second set of points (9P) and interacting with a second pressure cylinder (11) and a laminating cylinder (13), for forming, on a second ply (V2), a second set of protuberances (V2p) having larger sizes and a lower density than the protuberances of the first set; an adhesive dispenser (15) for applying an adhesive to one of said plies before lamination.</SDOAB >
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