发明名称 |
Hermetically sealed semiconductor laser device |
摘要 |
A wafer assembly that includes a wafer substrate. A plurality of micro-optomechanical or micro-optoelectrical devices are positioned on a surface of the wafer substrate. Each micro-optomechanical or micro-optoelectrical device has a seal surface. A plurality of seal caps are coupled to the micro-optomechanical or micro-optoelectrical devices. Each seal cap has a seal ring. The seal cap seal ring is coupled to a seal surface of the micro-optomechanical or micro-optoelectrical device to form a hermetic seal. |
申请公布号 |
AU4502500(A) |
申请公布日期 |
2000.12.28 |
申请号 |
AU20000045025 |
申请日期 |
2000.05.02 |
申请人 |
BANDWIDTH9, INC. |
发明人 |
CONSTANCE J. CHANG-HASNAIN;RENATO DATO;PHILIP WORLAND;RANG-CHEN YU |
分类号 |
H01S5/02;H01S5/022;H01S5/183 |
主分类号 |
H01S5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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