发明名称 |
MODULE COMPRISING AT LEAST A CHIP AND ITS COMMUNICATION INTERFACE, OBJECT COMPRISING A MODULE AND METHOD FOR MAKING SAID MODULES |
摘要 |
The invention concerns a method for making electronic devices comprising at least a chip (2) connected to a communication interface (32). The invention is characterised in that it comprises, for each chip, the following steps: providing the chip (2) in the form of a very thin semiconductor, said chip having at least a bump contact (8) on at least one of its faces (2a; 2b); providing an adhesive film (24) designed to receive the chip and its communication interface; transferring the chip onto a predetermined site of the adhesive support film with the or each bump contact electrically connected to a respective connection point of the communication interface; and transferring the whole assembly comprising the chip and the communication interface thus produced onto the adhesive film onto a support for which the chip is designed. The invention also concerns a module comprising at least a chip (2) and its communication interface assembled on an adhesive film (24) and an object comprising at least said modules. |
申请公布号 |
WO0077727(A1) |
申请公布日期 |
2000.12.21 |
申请号 |
WO2000FR01487 |
申请日期 |
2000.05.30 |
申请人 |
GEMPLUS;FIDALGO, JEAN-CHRISTOPHE;CALVAS, BERNARD;PATRICE, PHILIPPE |
发明人 |
FIDALGO, JEAN-CHRISTOPHE;CALVAS, BERNARD;PATRICE, PHILIPPE |
分类号 |
G06K19/077;H01L21/60;H01L23/498 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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