| 摘要 |
<p>A balace between flexibility, and high glass transition temperature and low dielectric constant is pursued with a composition useful as a prepreg for a printed circuit board comprising an epoxy resin, a styrene-maleic anhydride copolymer, a flexibilizer such as a phenoxy resin optionally containing hydroxy groups, and, optionally, a solvent system such as a mixture of cyclohexanone and methylethylketone.</p> |
