| 发明名称 |
Self-supported ultra thin silicon wafer process |
| 摘要 |
<p>A silicon wafer 2 has an ultra thin central portion 2 that is supported by a circumferential rim 3 of thicker silicon. The central region is thinned by conventional means using conventional removal apparatus. As an alternative method, the central portion is removed using a photoresist mask or a combination of a photoresist mask and a hard mask. <IMAGE></p> |
| 申请公布号 |
EP1061584(A2) |
申请公布日期 |
2000.12.20 |
| 申请号 |
EP20000110510 |
申请日期 |
2000.05.17 |
| 申请人 |
INTERSIL CORPORATION |
发明人 |
MORCOM, WILLIAM;SPINDLER, JEFFREY;AHRENS, STEPHEN;FORD, RAYMOND |
| 分类号 |
H01L21/02;H01L21/302;H01L21/306;H01L21/3065;H01L21/308;H01L21/336;H01L21/76;H01L29/78;(IPC1-7):H01L29/06 |
主分类号 |
H01L21/02 |
| 代理机构 |
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代理人 |
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