| 摘要 |
PCT No. PCT/CH94/00062 Sec. 371 Date Nov. 21, 1995 Sec. 102(e) Date Nov. 21, 1995 PCT Filed Mar. 23, 1994 PCT Pub. No. WO95/26122 PCT Pub. Date Sep. 28, 1995The multilayer foil circuit board according to the invention has rigid (s) and flexible (f) areas and in the rigid areas has more foil layers than in the flexible areas. The foil circuit board according to the invention is produced so that in the intended flexible areas (f) at least on one side at least the outermost foil layer (1.2) is removed by etching. By a corresponding etching mask design, it is possible to allow the flexible areas (f) to pass continuously into the rigid areas (s) in that the removal of the layers in the marginal areas (u) is less than in the center (z) of the flexible area (f), so that there are no marginal areas which have a tendency to break. The etching of the flexible areas can be performed in the same method stage as the etching of the plated through holes through the corresponding foil layer (1.2) or in a separate etching stage.
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