| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition used for a dry film resist excellent in sensitivity, resolving power, adhesion, plating characteristics and resist removability. SOLUTION: This photosensitive resin composition comprises a carboxyl- containing polymer, ethylenically unsaturated compounds and a photopolymerization initiator. The ethylenically unsaturated compounds include 3-70 wt.% photopolymerizable monomer of the formula [where R is H or methyl and (n) is an integer of 1-9] based on the total amount of the ethylenically unsaturated compounds, and a lophin dimer and p-aminophenyl ketone are preferably contained as the photopolymerization initiator. |
