| 摘要 |
PROBLEM TO BE SOLVED: To lessen an insulating board in size so as to reduce a semiconductor device in size as a whole and manufacturing cost by a method wherein some out of semiconductor chips mounted on the insulating board are dispersedly arranged on the lower end of an outer leas-out terminal. SOLUTION: An insulating board 16 is arranged on a metal heat dissipating plate 1. Only a semiconductor chip 6 as a functional element is mounted and fixed on the heat dissipating plate 1. On the other hand, a semiconductor chip 7 as a resistor is arranged on the lower end 2a of an outer lead-out terminal 2 provided to an insulating case 4 by insert molding. Then, an electrode formed on the surface of the semiconductor chip 6 and another electrode formed on the surface of the semiconductor chip 7 are connected together with a bonding wire 8. Moreover, the outer lead-out terminal 2 also serves as a gate terminal of a semiconductor device. By this setup, an expensive aluminum nitride insulating board can be lessened in size, and the semiconductor device can be reduced in manufacturing cost as a whole. |
