| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a power semiconductor module of satisfactory heat radiation characteristics by preventing cracks due to thermal fatigue caused by the difference in thermal deformations between an insulating member and a base plate, for reliable heat transfer. SOLUTION: Power semiconductor chips 106 and 108 are mounted on one surface via a first metal thin-plate 103, while the other surface comprises an insulating member 102 jointed to a base plate 101 with a joint member 105a via a second metal thin-plate 104. Here, at least four corners at the edge part of the second metal thin-plate 104 protrude beyond the edge part of the insulating member 102.</p> |
