发明名称 Device for cooling heat-producing unit by water evaporation, for cooling electronic components
摘要 The device for cooling by water evaporation comprises a receptacle (52) made of highly thermally conducting material with opening covered with a selectively permeable membrane for water vapor, forming a closed space in dissipator (51) where water is evaporated and entered by ducts (57a, 57b) from a reservoir (56) for water (54). The heat-producing unit as eg. central processing unit (CPU) (50) is in thermal contact with the wall (52b) of the receptacle (52), and dehydrated air circulates along the external surface of the membrane. In the second embodiment, recognizing that dehydrated air is humidified by absorbing water vapor, the water is collected from air humidified in circulation along the external surface of dissipator (51) for reuse; the system comprises a dehumidifier which separates water vapor contained in air by condensation, so that the air in water reservoir is of low humidity, an air circulation contour and means for returning the recovered water to the closed space in dissipator. In the third embodiment, the external surface of receptacle (52) is made to fit the surface of heat-producing unit (50) for an improved thermal contact. In the fourth embodiment, the receptacle is made of elastic material, eg. plastic laminated film, metallic film or stamped metallic film, to fit the surface of unit.
申请公布号 FR2794851(A1) 申请公布日期 2000.12.15
申请号 FR19990014357 申请日期 1999.11.16
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 MORIGUCHI TETSUO;HARA KAZUHIKO
分类号 H01L23/473;F28D5/00;H01L23/427 主分类号 H01L23/473
代理机构 代理人
主权项
地址